- 专利标题： Nanowire bundle and method of manufacturing nanostructure
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申请号： US15730376申请日： 2017-10-11
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公开(公告)号： US10354869B2公开(公告)日： 2019-07-16
- 发明人: Dae Hyun Kim , Jong Hyuk Kang , Hyun Deok Im , Hyun Min Cho , Yongju Kwon , Bomi Kim , Sung-Jee Kim , Mihye Lim
- 申请人： Samsung Display Co., Ltd. , POSTECH Academy-Industry Foundation
- 申请人地址： KR Yongin-si KR Pohang-si
- 专利权人： Samsung Display Co., Ltd.,POSTECH Academy-Industry Foundation
- 当前专利权人： Samsung Display Co., Ltd.,POSTECH Academy-Industry Foundation
- 当前专利权人地址： KR Yongin-si KR Pohang-si
- 代理机构： H.C. Park & Associates, PLC
- 优先权： KR10-2016-0132288 20161012
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; B82Y40/00 ; B82Y30/00
摘要：
A method of manufacturing a nanostructure includes: heating a mixed solution to a first temperature, the mixed solution including a solvent, a compound including indium, and an octadecylphosphonic acid; heating the mixed solution to a second temperature; injecting, after heating the mixed solution to the second temperature, a phosphine precursor into the mixed solution; and heating the mixed solution including the injected phosphine precursor to a third temperature.
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