Invention Grant
- Patent Title: Solid-state imaging device with layered microlenses and method for manufacturing same
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Application No.: US15653819Application Date: 2017-07-19
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Publication No.: US10355038B2Publication Date: 2019-07-16
- Inventor: Yoichi Ootsuka , Tomoyuki Yamashita , Kiyotaka Tabuchi , Yoshinori Toumiya , Akiko Ogino
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2011-217423 20110930
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/146 ; H04N5/335
Abstract:
A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
Public/Granted literature
- US20170317128A1 SOLID-STATE IMAGING DEVICE WITH LAYERED MICROLENSES AND METHOD FOR MANUFACTURING SAME Public/Granted day:2017-11-02
Information query
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