Invention Grant
- Patent Title: Metal oxide semiconductor device having mitigated threshold voltage roll-off and threshold voltage roll-off mitigation method thereof
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Application No.: US15622227Application Date: 2017-06-14
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Publication No.: US10355088B2Publication Date: 2019-07-16
- Inventor: Tsung-Yi Huang , Ying-Shiou Lin
- Applicant: RICHTEK TECHNOLOGY CORPORATION
- Applicant Address: TW Chupei, Hsinchu
- Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee Address: TW Chupei, Hsinchu
- Agency: Tung & Associates
- Priority: TW106100292A 20170105
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/10 ; H01L21/74 ; H01L29/08 ; H01L29/66

Abstract:
The present invention provides a MOS (Metal-Oxide-Silicon) device having mitigated threshold voltage roll-off and a threshold voltage roll-off mitigation method therefor. The MOS device includes: a substrate, a well region, an isolation region, a gate, two LDDs (Lightly-Doped-Drains), a source, a drain and a compensation doped region. The compensation doped region is substantially in contact with at least a part of a recessed portion along the channel length direction. Viewing from a cross-section view, at a boundary where the compensation doped region is in contact with the isolation region along the channel length direction, the compensation doped region has two doped region widths along the channel width direction, wherein, the two doped region widths of the compensation doped region are both not greater than 10% of the width of the operation region. Two doped region widths are defined as distances within an interior part and an exterior part of the operation region, respectively.
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