Invention Grant
- Patent Title: Integrated connector for electronic device
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Application No.: US15751018Application Date: 2015-09-23
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Publication No.: US10355384B2Publication Date: 2019-07-16
- Inventor: Kit Chew Chee , Ahmad Jalaluddin Yusof , Tin Poay Chuah
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Jaffery, Watson, Mendonsa & Hamilton LLP
- International Application: PCT/IB2015/057329 WO 20150923
- International Announcement: WO2017/051215 WO 20170330
- Main IPC: H01R3/00
- IPC: H01R3/00 ; H01R12/77 ; H01R12/79 ; H05K1/11 ; H01R13/627 ; H01R107/00 ; H05K3/46
Abstract:
In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.
Public/Granted literature
- US20180233841A1 INTEGRATED CONNECTOR FOR ELECTRONIC DEVICE Public/Granted day:2018-08-16
Information query
