- 专利标题: Embedded circuit board and method of making same
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申请号: US16147593申请日: 2018-09-29
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公开(公告)号: US10356909B1公开(公告)日: 2019-07-16
- 发明人: Ning Hou , Biao Li , Hao-Wen Zhong , Ming-Hui Wang
- 申请人: Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- 申请人地址: CN Shenzhen CN Qinhuangdao
- 专利权人: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- 当前专利权人: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- 当前专利权人地址: CN Shenzhen CN Qinhuangdao
- 代理机构: ScienBiziP, P.C.
- 优先权: CN201810821278 20180724
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H05K3/00 ; H05K3/34 ; H05K3/46
摘要:
An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.
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