Invention Grant
- Patent Title: Electroless nickel plating solution, electroless nickel plating method using same, and flexible nickel plated layer formed by using same
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Application No.: US14905376Application Date: 2014-07-01
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Publication No.: US10358724B2Publication Date: 2019-07-23
- Inventor: Hongkee Lee , Junmi Jeon
- Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Applicant Address: KR Chungcheongnam-Do
- Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Current Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0083856 20130716
- International Application: PCT/KR2014/005847 WO 20140701
- International Announcement: WO2015/008952 WO 20150122
- Main IPC: C23C18/32
- IPC: C23C18/32 ; C23C18/36 ; C23C18/34

Abstract:
The present invention provides an electroless nickel plating solution supplying high flexibility to a plated layer and having improved stability. The electroless nickel plating solution according to an embodiment of the present invention is an electroless nickel plating layer using an electroless nickel plating method. The electroless nickel plating solution comprises: a nickel metal salt providing a nickel ion for plating, and containing sulfamic acid nickel; a reducer reducing the nickel ion for plating; a complexing agent forming a complex together with the nickel ion for plating; and a cyan-based stabilizer providing stability of the electroless plating solution and preventing the generation of pits in a flexible nickel plated layer.
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Information query
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