A semiconductor package and a method of manufacturing the semiconductor package may be provided. The semiconductor package may include a first semiconductor chip disposed on a first surface of an interconnection layer, a second and a third semiconductor chips disposed on a second surface of the interconnection layer. The semiconductor package may include a thermal transfer plate disposed between the second and third semiconductor chips, contacting the second surface of the interconnection layer, and overlapping with the first semiconductor chip. The thermal transfer plate may be configured to provide a heat radiation path.