- Patent Title: Substrate construction and electronic package including the same
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Application No.: US15590111Application Date: 2017-05-09
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Publication No.: US10361150B2Publication Date: 2019-07-23
- Inventor: Chee-Key Chung , Yu-Min Lo , Han-Hung Chen , Chang-Fu Lin , Fu-Tang Huang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW106108535A 20170315
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/28 ; H01L23/31 ; H01L23/498
Abstract:
The disclosure provides a substrate construction applicable to a 3D package, including a silicon substrate for carrying a chip on an upper side thereof, and a circuit structure formed underneath the silicon substrate for being connected to solder balls via conductive pads of the circuit structure, thereby obtaining the same specification of the conductive pads as ball-planting pads of conventional package substrates and avoiding the manufacturing and use of conventional package substrates.
Public/Granted literature
- US20180269142A1 SUBSTRATE CONSTRUCTION AND ELECTRONIC PACKAGE INCLUDING THE SAME Public/Granted day:2018-09-20
Information query
IPC分类:
