Invention Grant
- Patent Title: Integrated circuit devices
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Application No.: US15981578Application Date: 2018-05-16
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Publication No.: US10361319B2Publication Date: 2019-07-23
- Inventor: Mirco Cantoro , Yeon-cheol Heo , Maria Toledano Luque
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2016-0100124 20160805
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/8238 ; H01L27/092 ; H01L29/423

Abstract:
An integrated circuit device includes a substrate, first and second fin active regions formed on the substrate and extending in a first direction parallel to a top surface of the substrate, a first gate structure disposed on a side surface of the first fin active region, a pair of first impurity regions respectively formed on a top portion and a bottom portion of the first fin active region, a second gate structure disposed on a side surface of the second fin active region, and a pair of second impurity regions respectively formed on a top portion or a bottom portion of the second fin active region, wherein the pair of first impurity regions vertically overlap each other, and the pair of second impurity regions do not vertically overlap each other.
Public/Granted literature
- US20180269333A1 INTEGRATED CIRCUIT DEVICES Public/Granted day:2018-09-20
Information query
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