Invention Grant
- Patent Title: Coupled resonator in a metal back cover
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Application No.: US15149024Application Date: 2016-05-06
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Publication No.: US10361588B2Publication Date: 2019-07-23
- Inventor: Seong Heon Jeong
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Hunter Clark PLLC
- Main IPC: H01F38/00
- IPC: H01F38/00 ; H02J50/12 ; G06F1/26 ; H02J7/02 ; H04B1/40 ; H02J7/00

Abstract:
An electronic device is disclosed, having electronic components and a metal case configured to house the electronic components. A power receiving element may be disposed on the metal case near an edge thereof. The power receiving element may couple with a magnetic field that emanates from the edge of the metal case, when the metal case is exposed to an externally generated magnetic field, to wirelessly receive power from the externally generated magnetic field.
Public/Granted literature
- US20170163094A1 COUPLED RESONATOR IN A METAL BACK COVER Public/Granted day:2017-06-08
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