Aspects of the disclosure include a machine and system for support removal and a laser-sintered component compatible with same. A laser-sintered component may have a component surface and at least one laser-sintered support extending from the component surface. A press may move a cutting surface along a cutting path adjacent to the component surface. The cutting surface has a shape complementary to the component surface and at least one cutting edge positioned to separate at least one laser-sintered support from the component surface as the cutting surface moves along the cutting path.