Invention Grant
- Patent Title: Dual-interface IC card
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Application No.: US15331739Application Date: 2016-10-21
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Publication No.: US10366320B2Publication Date: 2019-07-30
- Inventor: Christian Zenz
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP15190726 20151021
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077 ; H01L21/48 ; H01L23/498 ; H01L23/66 ; H01L23/00

Abstract:
The disclosure relates to a dual-interface integrated circuit (IC) card. Embodiments disclosed include a dual-interface card (100) comprising: a card body (122) containing an antenna (120), the antenna having first and second antenna connections; and a dual-interface integrated circuit card module (150) comprising: a substrate (104) having first and second opposing surfaces; a contact area (102) on the first surface of the substrate (104), the contact area (102) comprising a plurality of contact pads (108) and first and second routing connections (106) each having a first end and a second end; an integrated circuit (110) on the second surface of the substrate (104); electrical connections through the substrate (104) connecting the integrated circuit (110) to the plurality of contact pads (108) and to the first end of each of the first and second routing connections (106); and first and second antenna connectors (118) disposed in respective first and second holes (103) in the substrate (104) and in electrical contact with the second end of the respective first and second routing connections, wherein the first and second antenna connectors (118) of the card module are electrically connected to the first and second antenna connections of the card body (122).
Public/Granted literature
- US20170140257A1 DUAL-INTERFACE IC CARD Public/Granted day:2017-05-18
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