公开(公告)号：US09424507B2

公开(公告)日：2016-08-23

申请号：US14242031

申请日：2014-04-01

Applicant: NXP B.V.

Inventor： Christian Zenz ,  Tonny Kamphuis ,  Johannes Wilhelmus van Rijckevorsel ,  Bodin Kasemset ,  David Ceccarelli ,  Boudewijn van Blokland ,  Patrick Schoengrundner

IPC: G06K19/06 ,  G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07745 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/8592 ,  Y10T29/49018 ,  H01L2924/00014

Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Abstract translation: 描述了用于制造双接口IC卡组件的双接口集成电路（IC）卡组件和方法。 在一个实施例中，双接口IC卡部件包括单面接触基部结构，其包括具有电接触层的基板。 在单面接触基体结构上，一个或多个天线接触引线附接到单面接触基底结构以形成双界面接触结构，其是双接口IC卡的组件。 还描述了其它实施例。

公开(公告)号：US09245804B2

公开(公告)日：2016-01-26

申请号：US13967084

申请日：2013-08-14

Applicant: NXP B.V.

Inventor： Christian Zenz ,  Hartmut Buenning ,  Leonardus Antonius Elisabeth Van Gemert ,  Tonny Kamphuis ,  Sascha Moeller

IPC: H01L21/44 ,  H01L21/82 ,  H01L21/782 ,  H01L23/48 ,  H01L23/498 ,  H01L23/31 ,  H01L23/488 ,  H01L21/50 ,  H01L21/56 ,  H01L21/683 ,  H01L29/06 ,  H01L23/00

CPC classification number: H01L21/782 ,  H01L21/50 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/31 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/11 ,  H01L29/0657 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/014

Abstract: Consistent with an example embodiment, there is a semiconductor device, with an active device having a front-side surface and a backside surface; the semiconductor device of an overall thickness, comprises an active device with circuitry defined on the front-side surface, the front-side surface having an area. The back-side of the active device has recesses f a partial depth of the active device thickness and a width of about the partial depth, the recesses surrounding the active device at vertical edges. There is a protective layer of a thickness on to the backside surface of the active device, the protective material having an area greater than the first area and having a stand-off distance. The vertical edges have the protective layer filling the recesses flush with the vertical edges. A stand-off distance of the protective material is a function of the semiconductor device thickness and the tangent of an angle (θ) of tooling impact upon a vertical face the semiconductor device.

Abstract translation: 与示例性实施例一致，存在半导体器件，其中有源器件具有正面和背面; 总体厚度的半导体器件包括具有限定在前侧表面上的电路的有源器件，前侧表面具有区域。 有源器件的背面具有有源器件厚度的部分深度和大约部分深度的宽度的凹部，在垂直边缘处围绕有源器件的凹部。 在有源器件的背面具有厚度的保护层，该保护材料的面积大于第一区域并具有间隔距离。 垂直边缘具有填充与垂直边缘齐平的凹部的保护层。 保护材料的间隔距离是半导体器件厚度和在半导体器件的垂直面上的工具冲击的角度（＆amp;）的切线的函数。

公开(公告)号：US20140239471A1

公开(公告)日：2014-08-28

申请号：US13779889

申请日：2013-02-28

Applicant: NXP B.V.

Inventor： Peeradech Khunpukdee ,  Bodin Kasemset ,  Ernst Eiper ,  Christian Zenz

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/495 ,  H01L21/76838 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.

Abstract translation: 本公开的各个方面涉及集成电路（IC）管芯引线框封装。 根据一个或多个实施例，不锈钢引线框架设备具有粘附于不锈钢和IC管芯封装的基于聚合物的层，其中不锈钢在相应表面之间传导信号/数据以与封装的IC管芯连通。 在一些实施例中，该装置包括通过粘合剂粘附到基于聚合物的层的IC管芯，耦合到用于传递信号/数据的不锈钢引线框架的引线接合，以及封装IC管芯和引线接合的封装环氧树脂。

公开(公告)号：US10366320B2

公开(公告)日：2019-07-30

申请号：US15331739

申请日：2016-10-21

Applicant: NXP B.V.

Inventor： Christian Zenz

IPC: G06K19/06 ,  G06K19/077 ,  H01L21/48 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00

Abstract: The disclosure relates to a dual-interface integrated circuit (IC) card. Embodiments disclosed include a dual-interface card (100) comprising: a card body (122) containing an antenna (120), the antenna having first and second antenna connections; and a dual-interface integrated circuit card module (150) comprising: a substrate (104) having first and second opposing surfaces; a contact area (102) on the first surface of the substrate (104), the contact area (102) comprising a plurality of contact pads (108) and first and second routing connections (106) each having a first end and a second end; an integrated circuit (110) on the second surface of the substrate (104); electrical connections through the substrate (104) connecting the integrated circuit (110) to the plurality of contact pads (108) and to the first end of each of the first and second routing connections (106); and first and second antenna connectors (118) disposed in respective first and second holes (103) in the substrate (104) and in electrical contact with the second end of the respective first and second routing connections, wherein the first and second antenna connectors (118) of the card module are electrically connected to the first and second antenna connections of the card body (122).

公开(公告)号：US08987057B2

公开(公告)日：2015-03-24

申请号：US14021708

申请日：2013-09-09

Applicant: NXP B.V.

Inventor： Leonardus Antonius Elisabeth Van Gemert ,  Tonny Kamphuis ,  Hartmut Buenning ,  Christian Zenz

IPC: H01L21/00 ,  H01L23/544 ,  H01L21/56 ,  H01L21/78 ,  H01L23/28 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/28 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/96 ,  H01L24/97 ,  H01L41/338 ,  H01L2224/12105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00

Abstract: Consistent with an example embodiment, there is semiconductor device assembled to resist mechanical damage. The semiconductor device comprises an active circuit defined on a top surface, contact areas providing electrical connection to the active circuit. There is a pedestal structure upon which the active circuit is mounted on an opposite bottom surface; the pedestal structure has an area smaller than the area of the active device. An encapsulation, consisting of a molding compound, surrounds the sides and the underside of the active device and it surrounds the contact areas. The encapsulation provides a resilient surface protecting the active device from mechanical damage. A feature of the embodiment is that the contact areas may have solder bumps defined thereon.

Abstract translation: 与示例性实施例一致，存在组装以抵抗机械损坏的半导体器件。 半导体器件包括限定在顶表面上的有源电路，提供与有源电路的电连接的接触区域。 有一个基座结构，有源电路安装在基座结构的相对的底面上; 基座结构的面积小于有源器件的面积。 由模制化合物组成的封装围绕有源器件的侧面和下侧并且围绕接触区域。 封装提供了弹性表面，保护有源器件免受机械损坏。 该实施例的特征在于，接触区域可以具有限定在其上的焊料凸块。

公开(公告)号：US08884415B2

公开(公告)日：2014-11-11

申请号：US13779889

申请日：2013-02-28

Applicant: NXP B.V.

Inventor： Peeradech Khunpukdee ,  Bodin Kasemset ,  Ernst Eiper ,  Christian Zenz

IPC: H01L23/495 ,  H01L21/768

CPC classification number: H01L23/495 ,  H01L21/76838 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.

Abstract translation: 本公开的各个方面涉及集成电路（IC）管芯引线框封装。 根据一个或多个实施例，不锈钢引线框架设备具有粘附于不锈钢和IC管芯封装的基于聚合物的层，其中不锈钢在相应表面之间传导信号/数据以与封装的IC管芯连通。 在一些实施例中，该装置包括通过粘合剂粘附到基于聚合物的层的IC管芯，耦合到用于传递信号/数据的不锈钢引线框架的引线接合，以及封装IC管芯和引线接合的封装环氧树脂。

公开(公告)号：US20140110826A1

公开(公告)日：2014-04-24

申请号：US13966506

申请日：2013-08-14

Applicant: NXP B.V.

Inventor： Hartmut BUENNING ,  Christian Zenz

IPC: H01L29/06 ,  H01L21/78

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/73253 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Consistent with an example embodiment, there is a semiconductor device, having a topside surface and an underside surface, the semiconductor device comprises an active device of an area defined on the topside surface, the topside surface having a first area. A protective material is on to the underside surface of the semiconductor device, the protective material has an area greater than the first area. A laminating film attaches the protective material to the underside surface. The protective material serves to protect the semiconductor device from mechanical damage during handling and assembly onto a product's printed circuit board.

Abstract translation: 与示例实施例一致，存在具有顶侧表面和下表面的半导体器件，该半导体器件包括限定在顶侧表面上的区域的有源器件，顶侧表面具有第一区域。 保护材料在半导体器件的下表面上，保护材料具有大于第一区域的面积。 层压膜将保护材料附接到下表面。 保护材料用于在处理和组装到产品的印刷电路板上时保护半导体器件免受机械损坏。

公开(公告)号：US11222861B2

公开(公告)日：2022-01-11

申请号：US16523442

申请日：2019-07-26

Applicant: NXP B.V.

Inventor： Christian Zenz

IPC: H01L23/00 ,  G06K19/077 ,  H01Q1/22

Abstract: The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).

公开(公告)号：US10896878B2

公开(公告)日：2021-01-19

申请号：US16444322

申请日：2019-06-18

Applicant: NXP B.V.

Inventor： Antonius Hendrikus Jozef Kamphuis ,  Johannes Cobussen ,  Christian Zenz ,  Guido Albermann

IPC: H01L23/544 ,  H01L21/78 ,  H01L23/58 ,  H01L23/52 ,  H01L21/66 ,  H01L21/304

Abstract: A saw bow is provided and designed such that the conductors of the saw bow will break at a predictable location when using modern dicing techniques. This results in a break in the circuit provided by the saw bow, with any exposed conductors not being on the die side. Further, by providing a known breaking point in the saw bow, modern dicing techniques such as plasma dicing can be used, thereby allowing for the saw lane to be made narrower, which will in turn increase the number of wafers that can be included on a wafer.

公开(公告)号：US10461057B2

公开(公告)日：2019-10-29

申请号：US15283260

申请日：2016-09-30

Applicant: NXP B.V.

Inventor： Christian Zenz

IPC: H01L23/00 ,  H01Q1/22 ,  G06K19/077

Abstract: The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).