Invention Grant
- Patent Title: Hybrid multilayer device
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Application No.: US15324709Application Date: 2014-07-30
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Publication No.: US10366883B2Publication Date: 2019-07-30
- Inventor: Di Liang
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2014/048833 WO 20140730
- International Announcement: WO2016/018288 WO 20160204
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01L21/02 ; H01L21/764 ; H01L21/306 ; H01L31/0304 ; H01S5/02 ; H01S5/323 ; H01L31/102

Abstract:
A multilayer device includes a substrate and a first layer disposed on the substrate. A trench extends through one or both of the substrate and the first layer. The trench has a first sidewall spaced apart from a second sidewall, each sidewall extending from an upper surface of the substrate to a lower surface of the first layer. An optically active region is disposed on the first layer overlying the trench, such that at least a portion of the optically active region is located within a set of lines corresponding to the sidewalls of the trench.
Public/Granted literature
- US20170213729A1 HYBRID MULTILAYER DEVICE Public/Granted day:2017-07-27
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