Invention Grant
- Patent Title: Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package
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Application No.: US15427711Application Date: 2017-02-08
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Publication No.: US10366945B2Publication Date: 2019-07-30
- Inventor: Takuya Nakabayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2013-158442 20130731; JP2014-133120 20140627
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L33/62 ; H01L23/00 ; H01L33/54 ; H01L33/56

Abstract:
A lead frame includes at least one row of a plurality of unit regions arranged in a first direction. Each of the unit regions includes: a first lead; a second lead; and an isolation region configured to isolate the first lead from the second lead, the isolation region including a bent portion that is located at an end part of the second lead. The first lead has an extending portion extending along the end part of the second lead. The plurality of unit regions includes a first unit region, and a second unit region that is adjacent to the first unit region in the first direction. The first lead of the first unit region is connected to the first lead or second lead of the second unit region via the extending portion.
Public/Granted literature
Information query
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