Invention Grant
- Patent Title: High performance, scalable multi chip interconnect
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Application No.: US15244171Application Date: 2016-08-23
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Publication No.: US10367741B1Publication Date: 2019-07-30
- Inventor: Carl G. Ramey , Matthew Mattina
- Applicant: Mellanox Technologies, Ltd.
- Applicant Address: IL Yokneam
- Assignee: Mellanox Technologies, Ltd.
- Current Assignee: Mellanox Technologies, Ltd.
- Current Assignee Address: IL Yokneam
- Agency: Fish & Richardson P.C.
- Main IPC: H04L12/803
- IPC: H04L12/803 ; H04L29/08

Abstract:
A flexible, scalable server is described. The server includes plural server nodes each server node including processor cores and switching circuitry configured to couple the processor to a network among the cores with the plurality of cores implementing networking functions within the compute nodes wherein the plurality of cores networking capabilities allow the cores to connect to each other, and to offer a single interface to a network coupled to the server.
Information query