- Patent Title: Adjustable earcup in continuous headband-spring headphone system
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Application No.: US15726760Application Date: 2017-10-06
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Publication No.: US10368157B2Publication Date: 2019-07-30
- Inventor: Benjamin E. Zelnick , Bennett P. Daley , Daniel P. Baker
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: BOSE CORPORATION
- Current Assignee: BOSE CORPORATION
- Current Assignee Address: US MA Framingham
- Agency: Hoffman Warnick LLC
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033

Abstract:
Various implementations include headphone systems. In one implementation, a headphone system includes: a pair of earcups; a continuous headband spring connecting the pair of earcups, the continuous headband spring having an internal slot with an opening along an inner surface thereof; and an adjustment apparatus coupled with one of the pair of earcups and the continuous headband spring, the adjustment apparatus having: a shoe coupled with the one of the pair of earcups and positioned in the internal slot; a tongue coupled with the shoe and extending at least partially along the continuous headband spring; and a resistance member coupled with the tongue for resisting movement of the tongue relative to the continuous headband spring.
Public/Granted literature
- US20190110122A1 ADJUSTABLE EARCUP IN CONTINUOUS HEADBAND-SPRING HEADPHONE SYSTEM Public/Granted day:2019-04-11
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