公开(公告)号：US10368157B2

公开(公告)日：2019-07-30

申请号：US15726760

申请日：2017-10-06

Applicant: Bose Corporation

Inventor： Benjamin E. Zelnick ,  Bennett P. Daley ,  Daniel P. Baker

IPC: H04R1/10 ,  H04R5/033

Abstract: Various implementations include headphone systems. In one implementation, a headphone system includes: a pair of earcups; a continuous headband spring connecting the pair of earcups, the continuous headband spring having an internal slot with an opening along an inner surface thereof; and an adjustment apparatus coupled with one of the pair of earcups and the continuous headband spring, the adjustment apparatus having: a shoe coupled with the one of the pair of earcups and positioned in the internal slot; a tongue coupled with the shoe and extending at least partially along the continuous headband spring; and a resistance member coupled with the tongue for resisting movement of the tongue relative to the continuous headband spring.

公开(公告)号：US20190110122A1

公开(公告)日：2019-04-11

申请号：US15726760

申请日：2017-10-06

Applicant: Bose Corporation

Inventor： Benjamin E. Zelnick ,  Bennett P. Daley ,  Daniel P. Baker

IPC: H04R1/10

CPC classification number: H04R1/1066 ,  H04R1/1008 ,  H04R1/105 ,  H04R5/0335

Abstract: Various implementations include headphone systems. In one implementation, a headphone system includes: a pair of earcups; a continuous headband spring connecting the pair of earcups, the continuous headband spring having an internal slot with an opening along an inner surface thereof; and an adjustment apparatus coupled with one of the pair of earcups and the continuous headband spring, the adjustment apparatus having: a shoe coupled with the one of the pair of earcups and positioned in the internal slot; a tongue coupled with the shoe and extending at least partially along the continuous headband spring; and a resistance member coupled with the tongue for resisting movement of the tongue relative to the continuous headband spring.