Invention Grant
- Patent Title: Audio power circuit and method
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Application No.: US15362070Application Date: 2016-11-28
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Publication No.: US10368167B2Publication Date: 2019-07-30
- Inventor: Chen Kok Yeoh , Joo Yih See , Chin Seng Tan
- Applicant: MOTOROLA SOLUTIONS, INC.
- Applicant Address: US IL Chicago
- Assignee: MOTOROLA SOLUTIONS, INC.
- Current Assignee: MOTOROLA SOLUTIONS, INC.
- Current Assignee Address: US IL Chicago
- Agency: Michael Best & Friedrich LLP
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H03F1/02 ; H03F1/52 ; H04R3/00 ; H03F3/183 ; H04R29/00

Abstract:
An apparatus and method for controlling an audio power circuit. The audio power circuit includes an audio amplifier having a power input and a speaker connected to the audio amplifier. The audio power circuit also includes a control circuit configured to be connected to a battery and the power input and to control a supply of power to the power input. The audio power circuit further includes a thermal protection circuit connected between the audio amplifier and the speaker, the thermal protection circuit configured to generate a thermal protection signal and provide the same to the control circuit, wherein the control circuit is further configured to control the supply of power based on the thermal protection signal.
Public/Granted literature
- US20180152785A1 AUDIO POWER CIRCUIT AND METHOD Public/Granted day:2018-05-31
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