发明授权
- 专利标题: Conductor pad for flexible circuits and flexible circuit incorporating the same
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申请号: US15459740申请日: 2017-03-15
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公开(公告)号: US10368436B2公开(公告)日: 2019-07-30
- 发明人: Sridharan Venk , Earl Alfred Picard, Jr. , Qi Dai , Richard Garner
- 申请人: Sridharan Venk , Earl Alfred Picard, Jr. , Qi Dai , Richard Garner
- 申请人地址: US MA Wilmington
- 专利权人: OSRAM SYLVANIA Inc.
- 当前专利权人: OSRAM SYLVANIA Inc.
- 当前专利权人地址: US MA Wilmington
- 代理商 Shaun P. Montana
- 主分类号: F21S4/22
- IPC分类号: F21S4/22 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/00 ; H05K3/02 ; H05K3/28 ; H05K3/30 ; H01L23/00 ; H01L33/38 ; H01L33/44 ; H01L33/62 ; F21V21/005 ; G06K19/077
摘要:
A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.
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