- 专利标题： Shock absorbing structure adapted for a circuit board of an electronic device and electronic device therewith
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申请号： US15677034申请日： 2017-08-15
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公开(公告)号： US10368454B2公开(公告)日： 2019-07-30
- 发明人: Heng-Min Liu , Chun-Wang Lin , Chin-Chung Hung , Tsung-Hsien Chen , Shih-Wei Tung
- 申请人： Wistron Corporation
- 申请人地址： TW New Taipei
- 专利权人： Wistron Corporation
- 当前专利权人： Wistron Corporation
- 当前专利权人地址： TW New Taipei
- 代理商 Winston Hsu
- 优先权： TW106108853A 20170317
- 主分类号： H05K5/00
- IPC分类号： H05K5/00 ; H05K5/03 ; H05K5/02 ; H05K1/02
摘要：
A shock absorbing structure includes at least one protruding column and at least one resilient module. The at least one protruding column is fixed on an electronic device and passes through a circuit board of the electronic device. The at least one resilient module is disposed between the at least one protruding column and the circuit board. When the electronic device is affected by an external shock load, the at least one resilient module is forced by the circuit board to be deformed for generating a resilient force. When the at least one resilient module is not forced by the circuit board any more, the resilient force generated by the at least one resilient module drives the circuit board to recover.
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