Invention Grant
- Patent Title: Electrospun three-dimensional nanofibrous scaffolds with interconnected and hierarchically structured pores
-
Application No.: US15539517Application Date: 2015-12-23
-
Publication No.: US10369252B2Publication Date: 2019-08-06
- Inventor: Hao Fong , Tao Xu , Yong Zhao , Todd J. Menkhaus
- Applicant: South Dakota Board of Regents
- Applicant Address: US SD Pierre
- Assignee: South Dakota Board of Regents
- Current Assignee: South Dakota Board of Regents
- Current Assignee Address: US SD Pierre
- Agency: McKee, Voorhees & Sease, PLC
- International Application: PCT/US2015/000507 WO 20151223
- International Announcement: WO2016/105581 WO 20160630
- Main IPC: A61F2/00
- IPC: A61F2/00 ; A61F2/02 ; D01D5/00 ; A61L27/18 ; A61L27/38 ; A61L27/50 ; A61L27/54 ; A61L27/56 ; D04H1/728 ; D04H1/4242

Abstract:
The invention relates to electrospun three-dimensional (3D) nanofibrous scaffolds (with controllable porosities as high as about 96%) and methods of preparing the same. The electrospun 3D scaffolds possess interconnected and hierarchically structured pores with sizes ranging from tens of nanometers to hundreds of micrometers. In embodiments, the 3D scaffolds can be biocompatible and/or biodegradable. In some embodiments, the 3D scaffolds can be conductive. In some embodiments, the 3D scaffolds can contain bioactive species.
Public/Granted literature
Information query
IPC分类: