Invention Grant
- Patent Title: Adhesive film and organic electronic device including the same
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Application No.: US16024034Application Date: 2018-06-29
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Publication No.: US10374195B2Publication Date: 2019-08-06
- Inventor: Sung Chul Yoon , Cheol Heung Ahn , Hwi Yong Lee , Ji Woong Park , Dong Hyun Kim , Geoung Min Shin
- Applicant: SHINWHA INTERTEK CORP
- Applicant Address: KR
- Assignee: SHINWHA INTERTEK CORP
- Current Assignee: SHINWHA INTERTEK CORP
- Current Assignee Address: KR
- Agency: Alston & Bird LLP
- Priority: KR10-2017-0082429 20170629; KR10-2018-0058148 20180523
- Main IPC: H01L51/52
- IPC: H01L51/52

Abstract:
An adhesive film and an organic electronic device including the same are provided. The adhesive film includes: a first bonding layer including a first bonding component layer, a moisture absorbent, and first core shell particles; and a second bonding layer disposed below the first bonding layer and including second core shell particles, which are formed of a different material from the first core shell particles, wherein each of the first core shell particles includes a first shell and a first core surrounded by the first shell and each of the second core shell particles includes a second shell and a second core surrounded by the second shell.
Public/Granted literature
- US20190006624A1 ADHESIVE FILM AND ORGANIC ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2019-01-03
Information query
IPC分类: