公开(公告)号：US20190006624A1

公开(公告)日：2019-01-03

申请号：US16024034

申请日：2018-06-29

申请人： SHINWHA INTERTEK CORP

发明人： Sung Chul Yoon ,  Cheol Heung Ahn ,  Hwi Yong Lee ,  Ji Woong Park ,  Dong Hyun Kim ,  Geoung Min Shin

IPC分类号： H01L51/52

CPC分类号： H01L51/5259 ,  C08K9/02 ,  C08K2201/013 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  H01L51/5246

摘要： An adhesive film and an organic electronic device including the same are provided. The adhesive film includes: a first bonding layer including a first bonding component layer, a moisture absorbent, and first core shell particles; and a second bonding layer disposed below the first bonding layer and including second core shell particles, which are formed of a different material from the first core shell particles, wherein each of the first core shell particles includes a first shell and a first core surrounded by the first shell and each of the second core shell particles includes a second shell and a second core surrounded by the second shell.

公开(公告)号：US10374195B2

公开(公告)日：2019-08-06

申请号：US16024034

申请日：2018-06-29

申请人： SHINWHA INTERTEK CORP

发明人： Sung Chul Yoon ,  Cheol Heung Ahn ,  Hwi Yong Lee ,  Ji Woong Park ,  Dong Hyun Kim ,  Geoung Min Shin

IPC分类号： H01L51/52

摘要： An adhesive film and an organic electronic device including the same are provided. The adhesive film includes: a first bonding layer including a first bonding component layer, a moisture absorbent, and first core shell particles; and a second bonding layer disposed below the first bonding layer and including second core shell particles, which are formed of a different material from the first core shell particles, wherein each of the first core shell particles includes a first shell and a first core surrounded by the first shell and each of the second core shell particles includes a second shell and a second core surrounded by the second shell.