Invention Grant
- Patent Title: Wiring component
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Application No.: US15840192Application Date: 2017-12-13
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Publication No.: US10374301B2Publication Date: 2019-08-06
- Inventor: Yuhei Horikawa , Makoto Orikasa , Yoshihiro Kanbayashi , Hisayuki Abe , Hirohumi Asou , Kosuke Kunitsuka
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Main IPC: H01Q7/00
- IPC: H01Q7/00 ; H01Q1/38 ; H04B5/00 ; H01Q1/22

Abstract:
Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.
Public/Granted literature
- US20180175494A1 WIRING COMPONENT Public/Granted day:2018-06-21
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