公开(公告)号：US11410855B2

公开(公告)日：2022-08-09

申请号：US16997092

申请日：2020-08-19

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L21/48 ,  G03F7/00 ,  H01L33/62 ,  C23C18/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  H01L23/00 ,  C23C18/38 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US08787028B2

公开(公告)日：2014-07-22

申请号：US13677432

申请日：2012-11-15

Applicant: TDK Corporation

Inventor： Yuhei Horikawa ,  Shin Fujita ,  Kenichi Yoshida ,  Hisayuki Abe ,  Makoto Orikasa ,  Hideyuki Seike

IPC: H05K7/00 ,  H05K1/02 ,  H01R43/02

CPC classification number: H05K1/11 ,  H01R4/02 ,  H01R43/00 ,  H05K1/111 ,  H05K1/141 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/49204

Abstract: The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.

Abstract translation: 电子设备包括端子结构和包括端子结构的印刷电路板。 端子结构包括放置在布线导体上的焊点导体区域，与导体区域接触的中间层以及与中间层接触的焊料区域。 中间层包括包含锡和铜和镍中的至少一种作为主要成分的金属间化合物。 当导体区域的压痕弹性模量为E1，中间层的压痕弹性模量为E2时，E1与E2的比例等于或大于0.8且等于或小于1.5。

公开(公告)号：US11466368B2

公开(公告)日：2022-10-11

申请号：US16046422

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Makoto Orikasa ,  Yuhei Horikawa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hiroki Ashizawa ,  Miho Mori ,  Misaki Tamura

IPC: C23C18/16 ,  C23C18/31 ,  H05K1/03 ,  H05K3/06 ,  H05K3/18 ,  B32B15/00 ,  C23C18/38 ,  C23C18/30 ,  C23C18/32

Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.

公开(公告)号：US10304779B2

公开(公告)日：2019-05-28

申请号：US15791888

申请日：2017-10-24

Applicant: TDK Corporation

Inventor： Makoto Orikasa ,  Yuhei Horikawa ,  Hisayuki Abe ,  Yoshihiro Kanbayashi

IPC: H01L23/552 ,  H01L21/3205 ,  H01L21/56 ,  H01L21/288 ,  H01L23/31 ,  H01L23/00

Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.

公开(公告)号：US20180174748A1

公开(公告)日：2018-06-21

申请号：US15840243

申请日：2017-12-13

Applicant: TDK Corporation

Inventor： Yuhei Horikawa ,  Makoto Orikasa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hirohumi Asou ,  Kosuke Kunitsuka

IPC: H01F41/04 ,  H01F41/10 ,  C23C18/16 ,  C25D13/12 ,  C25D13/22

CPC classification number: H01F41/043 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/1653 ,  C25D5/48 ,  C25D13/12 ,  C25D13/22 ,  G06K19/07783 ,  H01F41/04 ,  H01F41/041 ,  H01F41/045 ,  H01F41/10 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H01Q9/27 ,  H05K3/181 ,  H05K3/188 ,  H05K3/241 ,  H05K3/242 ,  H05K3/246

Abstract: Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.

公开(公告)号：US10968519B2

公开(公告)日：2021-04-06

申请号：US16046359

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Makoto Orikasa ,  Yuhei Horikawa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe

IPC: C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  B32B27/08 ,  B32B27/36 ,  B32B15/09 ,  B32B15/20 ,  B32B3/30 ,  H01L23/52 ,  H01L27/15 ,  B32B27/18 ,  C23C18/30 ,  H01L23/498 ,  C23F1/02 ,  H01L33/62 ,  H01L23/14 ,  H01L25/075

Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

公开(公告)号：US10784122B2

公开(公告)日：2020-09-22

申请号：US16038711

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi Daitoku ,  Susumu Taniguchi ,  Akiko Seki ,  Atsushi Sato ,  Yuhei Horikawa ,  Makoto Orikasa ,  Hisayuki Abe

IPC: H01L21/48 ,  C23C18/20 ,  H01L33/62 ,  G03F7/00 ,  C23C18/18 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  H01L23/00 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US10374301B2

公开(公告)日：2019-08-06

申请号：US15840192

申请日：2017-12-13

Applicant: TDK Corporation

Inventor： Yuhei Horikawa ,  Makoto Orikasa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hirohumi Asou ,  Kosuke Kunitsuka

IPC: H01Q7/00 ,  H01Q1/38 ,  H04B5/00 ,  H01Q1/22

Abstract: Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.

公开(公告)号：US09224706B2

公开(公告)日：2015-12-29

申请号：US13960330

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi Yoshida ,  Makoto Orikasa ,  Hideyuki Seike ,  Yuhei Horikawa ,  Hisayuki Abe

IPC: H01L23/48 ,  H01L23/00

Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer.

公开(公告)号：US08970037B2

公开(公告)日：2015-03-03

申请号：US13960291

申请日：2013-08-06

Applicant: TDK Corporation

Inventor： Kenichi Yoshida ,  Makoto Orikasa ,  Hideyuki Seike ,  Yuhei Horikawa ,  Hisayuki Abe

IPC: H01L23/485 ,  H01L23/492 ,  H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, filling the opening on the electrode; and a dome-shaped bump containing Sn and Ti, covering the under bump metal layer, wherein at least part of the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer.

Abstract translation: 优选的端子结构包括基材; 形成在基材上的电极; 绝缘覆盖层，形成在所述基底材料上和所述电极上，并且具有暴露所述电极的至少一部分的开口; 含有Ni的下凸块金属层，填充电极上的开口; 以及包含Sn和Ti的圆顶状凸起，覆盖下凸块状金属层，其中至少部分下凸块金属层具有夹在外部电极和绝缘覆盖层之间的部分。