Invention Grant
- Patent Title: Electronic device, liquid ejection head, and method of manufacturing electronic device
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Application No.: US15735884Application Date: 2016-07-01
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Publication No.: US10377135B2Publication Date: 2019-08-13
- Inventor: Yasuhide Matsuo , Kenji Otsuka , Hiroyuki Tsuchiya , Kei Tadachi , Wataru Takahashi
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2015-148372 20150728
- International Application: PCT/JP2016/003154 WO 20160701
- International Announcement: WO2017/017899 WO 20170202
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; H01L41/047 ; H01L41/187
Abstract:
An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.
Public/Granted literature
- US20190001681A1 ELECTRONIC DEVICE, LIQUID EJECTION HEAD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2019-01-03
Information query
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