公开(公告)号：US09789691B2

公开(公告)日：2017-10-17

申请号：US14632801

申请日：2015-02-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki Tsuchiya ,  Yasuhide Matsuo ,  Kenji Otsuka ,  Minehiro Imamura ,  Tomohiro Hayashi ,  Kei Tadachi

IPC: B41J2/15 ,  B41J2/16 ,  C09J183/04 ,  C08G77/00

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

公开(公告)号：US11821086B2

公开(公告)日：2023-11-21

申请号：US17471230

申请日：2021-09-10

Applicant: Seiko Epson Corporation

Inventor： Kenji Otsuka ,  Kazuhiro Gomi

IPC: C23C16/455 ,  C23C16/02 ,  C23C16/44 ,  C23C16/56

CPC classification number: C23C16/45555 ,  C23C16/02 ,  C23C16/4412 ,  C23C16/45544 ,  C23C16/45553 ,  C23C16/56

Abstract: A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

公开(公告)号：US10189259B2

公开(公告)日：2019-01-29

申请号：US15671035

申请日：2017-08-07

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki Tsuchiya ,  Yasuhide Matsuo ,  Kenji Otsuka ,  Minehiro Imamura ,  Tomohiro Hayashi ,  Kei Tadachi

IPC: B41J2/16 ,  C09J183/04 ,  C08G77/00

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

公开(公告)号：US11220749B2

公开(公告)日：2022-01-11

申请号：US16802937

申请日：2020-02-27

Applicant: Seiko Epson Corporation

Inventor： Kenji Otsuka ,  Kazuhiro Gomi

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/02 ,  C23C16/44 ,  C23C16/56

Abstract: A particle coating method includes placing magnetic particles in a vessel, fixing the magnetic particles by a magnetic force caused by a magnetic field generated in the vessel, and forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method. Further, the method preferably includes forming a coating film on surfaces of the magnetic particles by an atomic layer deposition method in a state where the magnetic particles are fixed by the magnetic force in a first direction, thereby obtaining coated magnetic particles, and forming a coating film on surfaces of the coated magnetic particles in a state where the coated magnetic particles are fixed by the magnetic force in a second direction different from the first direction.

公开(公告)号：US10377135B2

公开(公告)日：2019-08-13

申请号：US15735884

申请日：2016-07-01

Applicant: Seiko Epson Corporation

Inventor： Yasuhide Matsuo ,  Kenji Otsuka ,  Hiroyuki Tsuchiya ,  Kei Tadachi ,  Wataru Takahashi

IPC: B41J2/14 ,  B41J2/16 ,  H01L41/047 ,  H01L41/187

Abstract: An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

公开(公告)号：US20190001681A1

公开(公告)日：2019-01-03

申请号：US15735884

申请日：2016-07-01

Applicant: Seiko Epson Corporation

Inventor： Yasuhide Matsuo ,  Kenji Otsuka ,  Hiroyuki Tsuchiya ,  Kei Tadachi ,  Wataru Takahashi

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14209 ,  B41J2/14233 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/1623 ,  B41J2002/14241 ,  B41J2002/14362 ,  H01L41/0472 ,  H01L41/1876

Abstract: An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

公开(公告)号：US10005279B2

公开(公告)日：2018-06-26

申请号：US15299899

申请日：2016-10-21

Applicant: SEIKO EPSON CORPORATION

Inventor： Wataru Takahashi ,  Yasuhide Matsuo ,  Kenji Otsuka

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14233 ,  B41J2/1433 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1646 ,  B41J2202/11

Abstract: A method for manufacturing a MEMS device in which a plurality of substrates are joined in a stacked state and one face of faces defining a space formed in one substrate of the plurality of substrates is a movable region is disclosed.