Invention Grant
- Patent Title: Wiring body, wiring board, touch sensor and method for producing wiring body
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Application No.: US15508310Application Date: 2015-12-25
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Publication No.: US10379645B2Publication Date: 2019-08-13
- Inventor: Takaharu Hondo
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2014-264492 20141226
- International Application: PCT/JP2015/086271 WO 20151225
- International Announcement: WO2016/104723 WO 20160630
- Main IPC: G06F3/041
- IPC: G06F3/041 ; H05K3/20 ; H05K3/38 ; G06F3/044 ; H05K1/02 ; H05K1/09 ; H05K3/12
Abstract:
A wiring body includes an adhesive layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.
Public/Granted literature
- US20170285786A1 WIRING BODY, WIRING BOARD, TOUCH SENSOR AND METHOD FOR PRODUCING WIRING BODY Public/Granted day:2017-10-05
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