公开(公告)号：US20180154616A1

公开(公告)日：2018-06-07

申请号：US15575623

申请日：2016-05-17

Applicant: FUJIKURA LTD.

Inventor： Shingo Ogura ,  Takaharu Hondo ,  Takeshi Shiojiri

IPC: B32B27/08 ,  G06F3/044 ,  H01B7/02 ,  H03K17/96

CPC classification number: B32B27/08 ,  B32B7/02 ,  B32B2307/202 ,  B32B2457/208 ,  G02F1/13338 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H01B5/14 ,  H01B7/02 ,  H01B13/00 ,  H01B13/0036 ,  H03K17/962

Abstract: A conductor-layer-equipped structure includes: a wiring body that includes a first resin layer, a first conductor layer provided on the first resin layer, and a second resin layer provided on the first resin layer so as to cover the first conductor layer; a cover glass that is in direct contact with one main surface of the wiring body or adheres to the one main surface of the wiring body via a first adhesion layer; and a liquid crystal panel that is in direct contact with the another main surface of the wiring body or adheres to the another main surface of the wiring body via a second adhesion layer. The first resin layer includes a material having optical isotropy. The second resin layer includes a material having optical isotropy. The material of the first resin layer and the material of the second resin layer have the same composition.

公开(公告)号：US10394398B2

公开(公告)日：2019-08-27

申请号：US15508839

申请日：2016-02-26

Applicant: FUJIKURA LTD.

Inventor： Takaharu Hondo ,  Takeshi Shiojiri

IPC: H05K1/00 ,  G06F3/044 ,  G06F3/041 ,  H05K1/02 ,  H01B5/14

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer including a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer including a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

公开(公告)号：US10345936B2

公开(公告)日：2019-07-09

申请号：US15508804

申请日：2016-05-17

Applicant: FUJIKURA LTD.

Inventor： Shingo Ogura ,  Takaharu Hondo ,  Takeshi Shiojiri

IPC: G06F3/041 ,  H05K1/18 ,  H05K3/46 ,  G06F3/044 ,  H01B5/14 ,  H01B13/00 ,  H05K3/20 ,  H05K3/38

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

公开(公告)号：US09880692B2

公开(公告)日：2018-01-30

申请号：US15508882

申请日：2016-02-01

Applicant: FUJIKURA LTD.

Inventor： Takeshi Shiojiri ,  Takaharu Hondo

IPC: G06F3/044 ,  H05K1/03 ,  H05K3/10 ,  H05K3/28

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1−H2|

公开(公告)号：US10379645B2

公开(公告)日：2019-08-13

申请号：US15508310

申请日：2015-12-25

Applicant: FUJIKURA LTD.

Inventor： Takaharu Hondo

IPC: G06F3/041 ,  H05K3/20 ,  H05K3/38 ,  G06F3/044 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12

Abstract: A wiring body includes an adhesive layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.

公开(公告)号：US20170277306A1

公开(公告)日：2017-09-28

申请号：US15508839

申请日：2016-02-26

Applicant: FUJIKURA LTD.

Inventor： Takaharu Hondo ,  Takeshi Shiojiri

IPC: G06F3/044 ,  H01B5/14 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F3/041 ,  H01B5/14 ,  H05K1/02

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer including a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer including a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

公开(公告)号：US09910552B2

公开(公告)日：2018-03-06

申请号：US15508882

申请日：2016-02-01

Applicant: FUJIKURA LTD.

Inventor： Takeshi Shiojiri ,  Takaharu Hondo

IPC: G06F3/044 ,  H05K1/03 ,  H05K3/10 ,  H05K3/28

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0313 ,  H05K3/10 ,  H05K3/28 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2201/10151

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1−H2|

公开(公告)号：US20170285786A1

公开(公告)日：2017-10-05

申请号：US15508310

申请日：2015-12-25

Applicant: FUJIKURA LTD.

Inventor： Takaharu Hondo

IPC: G06F3/041 ,  H05K3/20

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/092 ,  H05K3/1275 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2201/09827 ,  H05K2203/0113 ,  H05K2203/0502

Abstract: A wiring body includes an adhesive :layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.

公开(公告)号：US20170277289A1

公开(公告)日：2017-09-28

申请号：US15508804

申请日：2016-05-17

Applicant: FUJIKURA LTD.

Inventor： Shingo Ogura ,  Takaharu Hondo ,  Takeshi Shiojiri

IPC: G06F3/041 ,  H05K1/18 ,  H05K3/46

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H01B5/14 ,  H01B13/00 ,  H05K1/18 ,  H05K3/20 ,  H05K3/38 ,  H05K3/4682 ,  H05K2201/10151

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

公开(公告)号：US08894892B2

公开(公告)日：2014-11-25

申请号：US13873814

申请日：2013-04-30

Applicant: Fujikura Ltd.

Inventor： Takaharu Hondo

IPC: B29C59/16 ,  H05K3/00 ,  H05K3/10

CPC classification number: B29C59/16 ,  H05K3/0014 ,  H05K3/005 ,  H05K3/107 ,  H05K2203/0108

Abstract: Providing a mold and a manufacturing method therefor wherein protrusions are easy to be pressed into a resin base material and the protrusions are easy to be pulled out from the resin base material. The present invention provides a mold comprising a stamping surface (1a) formed depending on a via pattern and a protruding portion (21, 22) formed in convex shape from the stamping surface (1a), wherein the protruding portion has a base portion (111, 121) merging into a main surface of the stamping surface (1a) to have a curvature and a slope portion (113, 123) progressively decreasing in outer diameter thereof from the base portion (111, 121) to a top portion (112, 122) of the protruding portion (21, 22).

Abstract translation: 提供一种模具及其制造方法，其中突起容易被压入树脂基材中，并且突起容易从树脂基材拉出。 本发明提供一种模具，其具有由通孔图案形成的冲压面（1a）和从冲压面（1a）形成为凸状的突出部（21,22），其中，突出部具有基部（111 ，121）合并到冲压表面（1a）的主表面以具有曲率，并且其外径从基部（111,121）逐渐减小到顶部（112,121）的倾斜部分（113,123） 122）突出部分（21,22）。