Invention Grant
- Patent Title: Low resistance source drain contact formation
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Application No.: US15954300Application Date: 2018-04-16
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Publication No.: US10381442B2Publication Date: 2019-08-13
- Inventor: Oleg Gluschenkov , Zuoguang Liu , Shogo Mochizuki , Hiroaki Niimi , Chun-chen Yeh
- Applicant: International Business Machines Corporation , GLOBALFOUNDRIES Inc.
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Vazken Alexanian
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/161 ; H01L29/167 ; H01L29/417 ; H01L21/324 ; H01L21/02 ; H01L21/265 ; H01L29/45 ; H01L29/66 ; H01L29/165 ; H01L29/78 ; H01L21/285 ; H01L21/8238

Abstract:
Techniques for forming Ga-doped source drain contacts in Ge-based transistors are provided. In one aspect, a method for forming Ga-doped source and drain contacts includes the steps of: depositing a dielectric over a transistor; depositing a dielectric over the transistor; forming contact trenches in the dielectric over, and extending down to, source and drain regions of the transistor; depositing an epitaxial material into the contact trenches; implanting gallium ions into the epitaxial material to form an amorphous gallium-doped layer; and annealing the amorphous gallium-doped layer under conditions sufficient to form a crystalline gallium-doped layer having a homogenous gallium concentration of greater than about 5×1020 at./cm3. Transistor devices are also provided utilizing the present Ga-doped source and drain contacts.
Public/Granted literature
- US20180240875A1 Low Resistance Source Drain Contact Formation Public/Granted day:2018-08-23
Information query
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