Invention Grant
- Patent Title: Alternative ground lines for inter-slot grounding
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Application No.: US15910248Application Date: 2018-03-02
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Publication No.: US10384449B2Publication Date: 2019-08-20
- Inventor: Boon Bing Ng , Thida Ma Win , Jose Jehrome Rando
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Main IPC: B41J2/14
- IPC: B41J2/14 ; H01L23/522 ; H01L23/528 ; H01L23/00

Abstract:
In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
Public/Granted literature
- US20180186151A1 ALTERNATIVE GROUND LINES FOR INTER-SLOT GROUNDING Public/Granted day:2018-07-05
Information query
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