Invention Grant
- Patent Title: Diffusion resistant electrostatic clamp
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Application No.: US15448838Application Date: 2017-03-03
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Publication No.: US10385454B2Publication Date: 2019-08-20
- Inventor: Dale K. Stone , Richard Cooke , I-Kuan Lin , Julian G. Blake , Lyudmila Stone
- Applicant: Varian Semiconductor Equipment Associates, Inc. , Entegris, Inc.
- Applicant Address: US MA Gloucester US MA Billerica
- Assignee: Varian Semiconductor Equipment Associates, Inc.,Entegris, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.,Entegris, Inc.
- Current Assignee Address: US MA Gloucester US MA Billerica
- Agency: Diederiks & Whitelaw, PLC.
- Main IPC: C23C16/50
- IPC: C23C16/50 ; H01L21/683 ; H02N13/00 ; C23C28/04
Abstract:
In one embodiment, a method of fabricating an electrostatic clamp includes forming an insulator body, forming an electrode on the insulator body, and depositing a layer stack on the electrode, the layer stack comprising an aluminum oxide layer that is deposited using atomic layer deposition (ALD).
Public/Granted literature
- US20170335460A1 DIFFUSION RESISTANT ELECTROSTATIC CLAMP Public/Granted day:2017-11-23
Information query
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