Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US15617401Application Date: 2017-06-08
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Publication No.: US10388448B2Publication Date: 2019-08-20
- Inventor: Yuusuke Nagai , Takashi Suzuki , Kouichi Kakuda , Kunihiko Kawasaki , Shinichi Kondo , Yuya Ishima , Shinichi Sato , Masaki Takahashi , Takashi Endo
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-127779 20160628
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/255 ; H01F17/00

Abstract:
A multilayer coil component includes an element body including soft magnetic metal powders and a coil disposed in the element body. The coil includes a plurality of internal conductors electrically connected to each other. The plurality of internal conductors are separated from each other in a first direction and are adjacent to each other in the first direction. An average particle diameter of the soft magnetic metal powders located at an inner side of the coil when viewing from the first direction is larger than an average particle diameter of the soft magnetic metal powders located between the internal conductors adjacent to each other in the first direction.
Public/Granted literature
- US20170372829A1 MULTILAYER COIL COMPONENT Public/Granted day:2017-12-28
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