Invention Grant
- Patent Title: Wafer coating system and method of manufacturing chip package
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Application No.: US15098278Application Date: 2016-04-13
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Publication No.: US10388541B2Publication Date: 2019-08-20
- Inventor: Yu-Tung Chen , Quan-Qun Su , Chuan-Jin Shiu , Chien-Hui Chen , Hsiao-Lan Yeh , Yen-Shih Ho
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/687 ; H01L21/67 ; H01L23/31 ; H01L21/768 ; H01L21/02 ; H01L23/00
Abstract:
A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a rotating part, which the carrier part is mounted on the rotating part to carry a wafer, and the rotating part is configured to rotate with a predetermined axis. The flowing insulating material sprayer is above the wafer chuck and configured to spray a flowing insulating material to the wafer, and the wafer tilting lifting pin is configured to form a first acute angle between the wafer and direction of gravity.
Public/Granted literature
- US20160307779A1 WAFER COATING SYSTEM AND METHOD OF MANUFACTURING CHIP PACKAGE Public/Granted day:2016-10-20
Information query
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