Invention Grant
- Patent Title: Sensor
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Application No.: US15497661Application Date: 2017-04-26
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Publication No.: US10388593B2Publication Date: 2019-08-20
- Inventor: Insung Hwang , Wonhyeog Jin , Moosub Kim , Yunguk Jang
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Lee Hong Degerman Kang & Waimey
- Priority: KR10-2016-0051534 20160427
- Main IPC: H01L23/482
- IPC: H01L23/482 ; G01N27/12 ; H01L23/00

Abstract:
A sensor is disclosed. The sensor comprises a first substrate; a second substrate positioned relative to the first substrate; a first electrode located between the first substrate and the second substrate, the first electrode formed on the second substrate; a sensing portion covering at least a part of the first electrode and further covering at least a portion of the second substrate; a pad electrode located between the first substrate and the second substrate, wherein the pad electrode is formed on the second substrate and is electrically coupled to the first electrode; and a bonding pad located between the first substrate and the second substrate, wherein the bonding pad is formed on the first substrate and is electrically coupled to the pad electrode.
Public/Granted literature
- US20170316995A1 SENSOR Public/Granted day:2017-11-02
Information query
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