公开(公告)号：US11493469B2

公开(公告)日：2022-11-08

申请号：US16339973

申请日：2016-11-18

Applicant: LG ELECTRONICS INC.

Inventor： Insung Hwang ,  Byungkee Lee ,  Yunguk Jang ,  Sunjung Kim

IPC: G01N27/16 ,  G01N25/00 ,  G01N27/12 ,  G01N27/30

Abstract: A sensor is disclosed. The sensor according to an embodiment of the present invention may include a substrate; a first electrode pattern disposed on one side of the substrate to form a layer; a second electrode pattern disposed on the one side of the substrate to form a layer and separated from the first electrode pattern; a sensing layer located on the one side of the substrate and covering the first electrode pattern and the second electrode pattern and containing a semiconductor; a protective layer located on the one side of the substrate and covering at least a part of the sensing layer, and containing a material different from that of the sensing layer; a first electrode pad disposed on the one side of the substrate to form a layer and electrically connected to the first electrode pattern; a second electrode pad disposed on the one side of the substrate and electrically connected to the second electrode pattern; and a housing accommodating the substrate and including a filter spaced apart from the substrate, wherein the substrate includes an opening formed adjacent to an outer boundary of the first and second electrode patterns.

公开(公告)号：US10388593B2

公开(公告)日：2019-08-20

申请号：US15497661

申请日：2017-04-26

Applicant: LG ELECTRONICS INC.

Inventor： Insung Hwang ,  Wonhyeog Jin ,  Moosub Kim ,  Yunguk Jang

IPC: H01L23/482 ,  G01N27/12 ,  H01L23/00

Abstract: A sensor is disclosed. The sensor comprises a first substrate; a second substrate positioned relative to the first substrate; a first electrode located between the first substrate and the second substrate, the first electrode formed on the second substrate; a sensing portion covering at least a part of the first electrode and further covering at least a portion of the second substrate; a pad electrode located between the first substrate and the second substrate, wherein the pad electrode is formed on the second substrate and is electrically coupled to the first electrode; and a bonding pad located between the first substrate and the second substrate, wherein the bonding pad is formed on the first substrate and is electrically coupled to the pad electrode.