- 专利标题: Protection from ESD during the manufacturing process of semiconductor chips
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申请号: US15636533申请日: 2017-06-28
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公开(公告)号: US10388594B2公开(公告)日: 2019-08-20
- 发明人: Frederick Ray Gomez , Tito Mangaoang, Jr. , Jefferson Talledo
- 申请人: STMICROELECTRONICS, INC.
- 申请人地址: PH Calamba
- 专利权人: STMICROELECTRONICS, INC.
- 当前专利权人: STMICROELECTRONICS, INC.
- 当前专利权人地址: PH Calamba
- 代理机构: Seed IP Law Group LLP
- 主分类号: H01L21/48
- IPC分类号: H01L21/48 ; H01L21/56 ; H01L21/66 ; H01L23/00 ; H01L23/31 ; H01L23/60 ; H01L23/495
摘要:
According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.
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