Invention Grant
- Patent Title: Electronic part mounting heat-dissipating substrate
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Application No.: US15516730Application Date: 2015-11-20
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Publication No.: US10388596B2Publication Date: 2019-08-20
- Inventor: Shigeru Shimakawa , Takashi Sunaga , Takaaki Sekine , Teruyoshi Kogure , Ryoichi Suzuki
- Applicant: NSK LTD.
- Applicant Address: JP Tokyo
- Assignee: NSK LTD.
- Current Assignee: NSK LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-235691 20141120; JP2015-111257 20150601; JP2015-140106 20150714; JP2015-142495 20150716; JP2015-216153 20151102; JP2015-216154 20151102; JP2015-216156 20151102; JP2015-216396 20151104; JP2015-217012 20151104; JP2015-222242 20151112; JP2015-222243 20151112; JP2015-222246 20151112
- International Application: PCT/JP2015/082703 WO 20151120
- International Announcement: WO2016/080520 WO 20160526
- Main IPC: B62D5/04
- IPC: B62D5/04 ; G01R1/20 ; H01C1/14 ; H05K7/20 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/48 ; H01L25/07 ; H02K11/33 ; H01L23/373 ; H01L23/495 ; H01L23/498
Abstract:
An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.
Public/Granted literature
- US20170309555A1 ELECTRONIC PART MOUNTING HEAT-DISSIPATING SUBSTRATE Public/Granted day:2017-10-26
Information query
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