A video wall module and a method for producing a video wall module are disclosed. In embodiments, the video wall module includes a plurality of light emitting diode chips, each light emitting diode chip comprising a top electrode arranged at a top side of the light emitting diode chip, a bottom electrode arranged at a bottom side of the light emitting diode chip and a molded body embedding the light emitting diode chips, a front-side metallization arranged at the front side of the molded body, wherein the top electrodes are connected to the front-side metallization, a rear-side metallization arranged at a rear side of the molded body, wherein the bottom electrodes are connected to the rear-side metallization, a dielectric layer arranged at the rear side of the molded body and an outer metallization arranged at the dielectric layer, wherein the rear-side metallization is electrically conductively connected to the outer metallization.