Invention Grant
- Patent Title: Parasitic capacitance reducing contact structure in a finFET
-
Application No.: US15815626Application Date: 2017-11-16
-
Publication No.: US10388769B2Publication Date: 2019-08-20
- Inventor: Miaomiao Wang , Tenko Yamashita , Chun-chen Yeh , Hui Zang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Garg Law Firm, PLLC
- Agent Rakesh Garg; Grant Johnson
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/66 ; H01L21/768 ; H01L29/417 ; H01L29/423 ; H01L21/8234

Abstract:
In a fin-Field Effect Transistor (finFET), a recess is created at a location of a fin, the fin being coupled to a gate of the finFET, the recess extending into a substrate interfacing with the gate. The recess is filled at least partially with a first conductive material. The first conductive material is insulated from the gate. The fin is replaced with a replacement structure. The replacement structure is electrically connected to the first conductive material using a second conductive material. The second conductive material is insulated from a first surface of the finFET. A first electrical contact structure is fabricated on the first surface. A second electrical contact structure is fabricated on a second surface of the finFET, the second surface being on a different spatial plane than the first surface.
Public/Granted literature
- US20180076304A1 PARASITIC CAPACITANCE REDUCING CONTACT STRUCTURE IN A FINFET Public/Granted day:2018-03-15
Information query
IPC分类: