Invention Grant
- Patent Title: Method for manufacturing semiconductor element by dividing semiconductor wafer using pressing member having tip portion
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Application No.: US16149898Application Date: 2018-10-02
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Publication No.: US10388827B2Publication Date: 2019-08-20
- Inventor: Hiroki Okamoto , Hiroaki Tamemoto , Junya Narita
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Hunton Andrews Kurth LLP
- Priority: JP2015-131776 20150630
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L21/78 ; H01L21/304 ; H01L21/683 ; H01L29/04
Abstract:
A method for manufacturing a semiconductor element is provided. The method includes providing a semiconductor wafer including a substrate and a semiconductor structure on the substrate, forming a cleavage starting portion in the semiconductor wafer, and dividing the semiconductor wafer into a plurality of semiconductor elements by transferring a pressing member on the semiconductor wafer in a state where the pressing member is pressed against the semiconductor wafer to separate the semiconductor wafer at the cleavage starting portion. The pressing member includes a tip portion to be pressed on the semiconductor wafer, and the tip portion has a spherical surface.
Public/Granted literature
- US20190035973A1 METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT OF POLYGON SHAPE Public/Granted day:2019-01-31
Information query
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