- 专利标题: Synchronize-able modular physical layer architecture for scalable interface
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申请号: US14981220申请日: 2015-12-28
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公开(公告)号: US10389341B1公开(公告)日: 2019-08-20
- 发明人: Chee Hak Teh
- 申请人: ALTERA CORPORATION
- 申请人地址: US CA San Jose
- 专利权人: Altera Corporation
- 当前专利权人: Altera Corporation
- 当前专利权人地址: US CA San Jose
- 主分类号: H03K5/133
- IPC分类号: H03K5/133 ; G06F1/10 ; G06F13/40 ; H03K5/135 ; H03K5/00
摘要:
One embodiment relates to an integrated circuit with an array of modular physical layer (PHY) slice circuits that are configured into multiple synchronous groups. Each synchronous group receives a delayed synchronous pulse signal provided by a chain of synchronous delay circuits. Another embodiment relates to an array of modular PHY slice circuits, each of which includes a manager circuit that manages the modular PHY slice circuit, a remap circuit that remaps interconnect redundancy, and an input-output module that provides outbound control and data streams and receives inbound control and data streams.
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