Invention Grant
- Patent Title: Flexible printed circuit board having slit
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Application No.: US16133820Application Date: 2018-09-18
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Publication No.: US10390431B2Publication Date: 2019-08-20
- Inventor: Mitsuki Kanda , Takatoshi Yagisawa , Osamu Daikuhara , Hideo Miyazawa
- Applicant: FUJITSU COMPONENT LIMITED
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2017-188250 20170928
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H01R12/77

Abstract:
A flexible printed circuit board for coupling to a connector having a plurality of contacts includes a flexible film, a plurality of electrodes disposed on at least one face of the film and configured to come in contact with the contacts of the connector, and one or more slits formed in the film between adjacent electrodes among the plurality of electrodes.
Public/Granted literature
- US20190098757A1 FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2019-03-28
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