- 专利标题: Housing, circuit arrangement, drive arrangement and method for producing the circuit arrangement
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申请号: US14787073申请日: 2014-04-16
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公开(公告)号: US10390467B2公开(公告)日: 2019-08-20
- 发明人: Christian Nassler , Thomas Voelkl
- 申请人: Conti Temic microelectronic GmbH
- 申请人地址: DE Nuremberg
- 专利权人: CONTI TEMIC MICROELECTRONIC GMBH
- 当前专利权人: CONTI TEMIC MICROELECTRONIC GMBH
- 当前专利权人地址: DE Nuremberg
- 代理机构: Slayden Grubert Beard PLLC
- 优先权: DE102013207673 20130426
- 国际申请: PCT/EP2014/057841 WO 20140416
- 国际公布: WO2014/173790 WO 20141030
- 主分类号: H05K9/00
- IPC分类号: H05K9/00 ; H02K5/22 ; H02K11/00 ; H02K11/02 ; H05K3/30 ; H05K3/32 ; H05K5/02 ; H05K7/02
摘要:
A housing for a circuit assembly includes a housing interior chamber, an electromagnetic radiation-impermeable partition wall that divides the housing interior chamber into (a) a first housing interior chamber partial region configured to receive a first electrical component designed as a filter component and (b) a second housing interior chamber partial region configured to receive a second electrical component, an electromagnetic radiation-impermeable cover plate, and an electromagnetic radiation-impermeable housing section directly adjacent to the first housing interior chamber region. The partition wall, the cover plate, and the housing section enclose the first housing interior chamber partial region in three dimensions, creating a complete electromagnetic shielding of the first housing interior chamber partial region from the second housing interior chamber partial region. A circuit assembly having such a housing can be cost-effectively produced and has a reduced scope.
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