Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US15611884Application Date: 2017-06-02
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Publication No.: US10395836B2Publication Date: 2019-08-27
- Inventor: Takashi Sawada , Yasuo Fujii , Takayuki Kayatani
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-112717 20160606
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/005 ; H01G4/12 ; H01G4/248 ; H01K1/18 ; H05K1/18 ; H01G4/012 ; H01G4/224 ; H01G4/232

Abstract:
A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the pair of insulating coating portions, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the first external electrode and pair of second external electrodes, which is located closest to the first principal surface.
Public/Granted literature
- US20170352486A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2017-12-07
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