- 专利标题: Multilayer ceramic electronic component
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申请号: US16253705申请日: 2019-01-22
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公开(公告)号: US10395839B1公开(公告)日: 2019-08-27
- 发明人: Chae Min Park , Ki Won Kim , Ji Hee Moon , Dong Hwi Shin , Sang Soo Park , Woo Chul Shin
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon-si, Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-Do
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2018-0141421 20181116
- 主分类号: B32B15/08
- IPC分类号: B32B15/08 ; H01G4/30 ; H01G2/06 ; H01G4/12 ; H01G4/008 ; H01G4/14
摘要:
A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers, and a water repellent layer including a portion disposed to cover a gap between the ceramic body and the first and second plating layers, having a first thickness and a portion disposed to cover a surface of the ceramic body, to having a second thickness, smaller than the first thickness.
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