Multilayer electronic component
    1.
    发明授权

    公开(公告)号:US12009150B2

    公开(公告)日:2024-06-11

    申请号:US18144390

    申请日:2023-05-08

    IPC分类号: H01G4/005 H01G4/08 H01G4/30

    CPC分类号: H01G4/005 H01G4/08 H01G4/30

    摘要: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

    Multilayer capacitor and board having the same mounted thereon

    公开(公告)号:US11694847B2

    公开(公告)日:2023-07-04

    申请号:US17697172

    申请日:2022-03-17

    摘要: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

    Electronic component
    7.
    发明授权

    公开(公告)号:US11651897B2

    公开(公告)日:2023-05-16

    申请号:US17173526

    申请日:2021-02-11

    IPC分类号: H01G4/232 H01G4/30

    CPC分类号: H01G4/232 H01G4/30

    摘要: An electronic component includes a capacitor body having alternately stacked first and second internal electrodes with dielectric layers therebetween, the capacitor body having first to sixth surfaces and the first internal electrodes and the second internal electrodes being exposed through the third surface and the fourth surface, respectively. First and second external electrodes are disposed respectively on the third and fourth surfaces of the body and respectively connected to the first and second internal electrodes. A shielding layer includes a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth, and sixth surfaces of the capacitor body, and an insulating layer is disposed between the capacitor body and the shielding layer. The shielding layer consists of first and second shielding layers offset from each other in a direction connecting the third and fourth surfaces.

    Manufacturing method of multilayer ceramic electronic component

    公开(公告)号:US11636983B2

    公开(公告)日:2023-04-25

    申请号:US17726888

    申请日:2022-04-22

    IPC分类号: H01G4/30 H01G4/012 H01G4/12

    摘要: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as σtd, while an average thickness of the first and second internal electrodes is referred to as to and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as σte, a ratio (σte/σtd) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10≤σte/σtd≤1.35.

    Multilayer ceramic capacitor
    9.
    发明授权

    公开(公告)号:US11527358B2

    公开(公告)日:2022-12-13

    申请号:US17349304

    申请日:2021-06-16

    IPC分类号: H01G4/01 H01G4/12

    摘要: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.