- 专利标题: Multilayer ceramic electronic component
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申请号: US16257642申请日: 2019-01-25
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公开(公告)号: US10395840B1公开(公告)日: 2019-08-27
- 发明人: Chae Min Park , Ki Won Kim , Ji Hee Moon , Dong Hwi Shin , Sang Soo Park , Woo Chul Shin
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon-si, Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-Do
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2018-0141420 20181116
- 主分类号: B32B15/08
- IPC分类号: B32B15/08 ; H01G4/30 ; H01G2/06 ; H01G4/008 ; H01G4/12 ; H01G4/14
摘要:
A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween, first and second external electrodes disposed on first and second external surfaces of the ceramic body, respectively, the first and second external electrodes each including first and second base electrode layers having at least a portion in contact with first and second external surfaces of the ceramic body, respectively, and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and a water repellent layer disposed to cover both external side surfaces of the first and second plating layers and a surface of the ceramic body.
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