The embodiments of the present disclosure provide a bonding device for a chip on film and a display panel and a bonding method for the same. The bonding device includes: a bearing stage having a horizontal bearing surface for supporting at least one row of display panels, wherein one row of the at least one row of display panels has a row of first bonding regions; a grasping unit disposed above the bearing stage and configured to grasp at least a partial area of the entire chip on film so that a row of second bonding regions of the entire chip on film is horizontally located above the one row of display panels; and a bonding unit configured to bond the row of second bonding regions which has been aligned with the row of first bonding regions to the row of first bonding regions.